IEEE PELS Students and Young Professionals Symposium 2023


Shanghai, China

Call for Papers

Submit Now!

Digest Submission Due: Jun. 2, 2023

Notifications of Acceptance: Jun. 19, 2023

Final Paper Submission Due: Aug. 5, 2023

Prospective authors are invited to electronically submit digests of their work in English (Maximum 5 pages in double space, in PDF format), following the instructions available on the website: The digest is a summary of your paper including the digest title, abstract, digest text and references.

Accepted and presented papers will be published in the conference proceedings, and submitted to the IEEE Xplore on-line digital library and EI Compendex. Several selected best paper awards will be given with certificates and monetary prize. 

The worldwide power electronic industry, research, and academia are cordially invited to participate in an array of presentations, tutorials, and social activities for the advancement of science, technology, engineering education, and fellowship. Technical interests of the conference include, but are not limited to:

Track 1: Energy Conversion Systems and Applications

• Renewable and alternative energy power electronics systems

•  Critical power and energy storage systems

• Aerospace energy conversion systems

• Grid-forming technologies

• High power/voltage power conversion (HVDC, FACTS and multi-terminal DC systems)

• Power-to-X and green hydrogen systems

• Microgrids, hybrid ac/dc grids, and de grids

• Energy access and off-grid systems

• Energy conversion for information technology and communication systems

• Electrification for commercial, industrial and transportation applications

• Big data and artificial intelligence in energy conversion

• Wireless power transfer

• Lighting applications and displays

• Industrial motor drives

• Medical, loT and energy harvesting

• Power electronics for agriculture

Track 2:Component, Converter and Subsystem Technologies

• Power electronic devices, gate drivers, and integrated circuits

• Passive components and materials

• Power electronic packaging integration

• Reliability, advanced fault protection systems, diagnostics, prognostics, and health 


• Thermal management and advanced cooling technologies

• Innovative magnetic materials, alternative conductor and winding insulation technologies

• Electromagnetic interference and electromagnetic compatibility

• Power conversion topologies, modulation, and control

• Electrical drive systems and topologies and their control

• Rotating/linear electromechanical devices

• Advanced manufacturing

• Digital twins, cloud design and simulation techniques for energy conversion systems

• Cyber-and-physical security for power electronics systems

          Download CFP Flyer                            

    Download Template_Digest                      

Download Template_Final_Paper                  

Diamond Sponsors

  • 台达电子企业管理(上海)有限公司

Gold Sponsors

  • 三菱电机机电(上海)有限公司

Silver Sponsors

  • 江苏宏微科技股份有限公司

  • 苏州汇川控制技术有限公司

  • 上海科梁信息科技股份有限公司

  • 维谛技术有限公司

Friendly Sponsors

  • 广州三晶电气股份有限公司

  • 南京瑞途优特信息科技有限公司

  • 上海鹰峰电子科技股份有限公司

  • 日置(上海)测量仪器有限公司

  • 深圳古瑞瓦特新能源有限公司

  • 致茂电子(苏州)有限公司

  • 北京链宇科技有限责任公司

  • 阳光电源股份有限公司


  • Chinese Journal of Electrical Engineering

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